Asetek Offers Data Centers Liquid Cooling Solutions

By ServerWatch Staff (Send Email)
Posted January 3, 2012

Liquid cooling solutions provider, Asetek Inc., said it plan to offer a range of liquid cooling solutions to address a diverse set of cooling challenges facing modern HPC clusters data centers. The challenges range from reducing latency in high frequency trading applications, to increasing performance and density in servers. Asetek said that by Leveraging its existing CPU and GPU liquid cooling technology brings both proven reliability and high volume cost advantages to Asetek’s data center liquid cooling solutions. The solutions include Internal Loop Liquid Cooling, Rack CDU Liquid Cooling and Sealed Server Liquid Cooling.


"The benefit of Asetek liquid cooling technology is its efficiency in removing heat directly from processors and moving that heat to an optimal place for transferring it to the environment. The success of Asetek’s technology results from its reliability, affordability and suitability for installation in high volume computer manufacturing. Asetek data center liquid cooling solutions utilize this technology to provide three general levels of server cooling:

"Internal Loop Liquid Cooling enables the use of the fastest processors, including high wattage processors, in high density servers.

"Rack CDU Liquid Cooling removes processor and or GPU heat from rack servers and blades out of the data center without the use of traditional computer room air conditioners or water chillers, enabling extreme densities on server, rack and data center level. The strongest value proposition however, that the solution uses free outside ambient air cooling allowing around 50% power savings on the data center cooling cost.

"Sealed Server Liquid Cooling removes all server heat from the data center via liquid; literally no air from inside the data center is used for server cooling. This solution enables high density with high performance processors and ambient room temperature server cooling."

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